After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest ...

Ltd. This system will not only improve the efficiency of the through-Si via formation process, but also enable direct ...

This innovation will significantly help increase energy efficiency, power density and reliability in power conversion ...

Infineon has cut the thickness of its silicon power wafer in half to 20µm, reducing the RDSon by 40% and the overall power losses by 15%.

Infineon unveils 'world's thinnest' silicon power wafer Infineon Technologies has unveiled what it describes as“the next ...

Ultra-thin power semiconductor wafers, cutting substrate resistance by half for over 15% power loss reduction, supporting ...

Infineon Technologies AG announced it has unveiled an advance in handling and processing "the thinnest silicon power wafers ever manufactured," with a thickness of 20 micrometers and a diameter of 300 ...

Q3 2024 Earnings Conference Call November 7, 2024 2:00 AM ETCompany ParticipantsKurt Levens - Chief Executive OfficerJack ...

Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different ...

"The world's thinnest silicon wafer is proof of our dedication to deliver outstanding customer value by pushing the technical boundaries of power semiconductor technology," said Jochen Hanebeck, CEO ...