Application Note Package Thermal Characteristics Introduction Managing heat in CMOS Logic devices is a growing issue for today's system designers. As densities increase and process geometries and form ...

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are ...

As some of the newer dc-dc point-of-load (POL) converters are packaged into smaller and smaller surface-mount packages, thermal and electrical layout is becoming critical. One of the packages that ...

How finite element analysis and other technologies are being used to reduce risk and uncertainty of thermal impacts in advanced packaging. Managing heat in chips is becoming a precision balancing act ...

The primary goal in thermal design is to limit the junction temperature of integrated circuits. In their lists of absolute maximum ratings (Table 1), all IC manufacturers include the maximum operating ...

• Market leading compact LGA package offers design flexibility for enhanced thermal performance • A high-performance, flexible power solution for all markets, especially ICT, telecom and industrial ...

Managing the heat within smaller packages is a technical challenge that requires innovative solutions, discovers Liam Critchley. The power demands of high-performance electronics generate heat as a ...