The artificial intelligence (AI) revolution has expanded rapidly since 2023, powering applications from chatbots to ...

The global semiconductor and IC packaging materials market generated revenue of USD 48.48 billion in 2025, and is projected to grow to USD 114.28 billion in 2034, according to research conducted by ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

Companies and governments invested heavily in onshoring fabs and facilities over the past 12 months as tariffs threatened to ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

Amid US-China trade tensions and the potential for new US semiconductor tariffs under President Donald Trump, Taiwan's IC packaging and testing industry is showing strong first-quarter 2025 results.

As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor ecosystem.

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...