The design stage of a product’s life cycle is arguably one of the most crucial decision making periods, as 70 to 80 percent of the overall manufacturing cost can be projected at this stage. Engineers ...

Whether you are specifying new equipment or improving existing processes, this session will provide practical insight into building adaptable assembly strategies that support growth, reliability, and ...

The integration level of a system-on-chip (SoC) is defined in RTL, just like the rest of the design. Historically, RTL has been built through text editors. However, a decade or more ago, the sheer ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

Some joint-design considerations are universal; others vary with the assembly methods used. Each joining technique has particular design requirements, while certain joint requirements may suggest a ...

The Fred Young Submillimeter Telescope (FYST) is a 6-meter-diameter state-of-the-art telescope designed to operate at submillimeter to millimeter wavelengths for wide field observations and large-area ...

To get its engineers thinking about design for assembly back in the 1980s, Westinghouse made a video about a product optimized for assembly: the IBM Proprinter. The technology may be dated, but the ...

[Will Cogley] makes eyeballs; hey, everyone needs a hobby, and we don’t judge. Like all his animatronics, his eyeballs are wondrous mechanisms, but they do tend toward being a bit complex, especially ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...

It can be easy to take the humble terminal block for granted. Like the steel girder on a bridge, terminal blocks provide necessary structure and stability within the electrical panel. But once they’re ...